No mechanical stress on substrates or circuit
No tooling cost or consumables.
Versatility – the ability to change applications by simply changing settings
Fiducial Recognition – more precise and clean-cut
Optical Recognition before the PCB depaneling/singulation process begins
Ability to depanel virtually any substrate. (Rogers, FR4, Chema, Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50 microns.>
No design limitation – the ability to cut virtually any size PCB board including complex contours and multidimensional boards

Specification:

Specification
Cutting accuracy of the whole machine: 0.02mm	humidity: ＜60%
size of processed products: 330330mm/330670	floor loading: 1500kgf/m2
moving speed of the platform:300mm/s	human-computer operation and data storage: industrial computer
processing speed of the vibration mirror: ≤50000mm/s	size of the host computer: 125013001600 (L X H X D)mm
minimum processing line width: 0.0015mm	Machine Weight: 1500 Kg
positioning accuracy of the platform: 0.002mm	Equipment Source: AC220/3KW
operation interface: Chinese/English interface	operating system: Windows7
repeatability of the platform: 0.002mm	processing picture file: Gerber或DXF
size of the dust collector: 500650900 (L X H X D)mm	compensation for shrinkage and expansion: Automatic compensation of MARK points
ambient temperature: 20±2℃	dust collector: 1.5KW
the power supply of the dust collector: AC 220V 50/60Hz	dust collector weight: 85Kg

PCB Laser Depaneling Detailed Photos:

CE approval

Production flow

24 Hours Service, Welcome to Inquiry!!

Inquiry Cart 0